|
Substrate
|
Via Hole
|
Adhesion / Seed
Layer
|
Functional / Conductive
Layer
|
Barrier / Bonding Layer
|
Passivation Layer
|
|
Al2O3
17 - 27 W/mK
Up to 4.5"
|
50 - 200 um
|
Ti / Cu
|
Electroplating
Cu
5 - 100 um in thickness
|
Electroplating
Cu
5 - 100 um in thickness
|
Solder
Mask
25 - 30 um in thickness
|
|
TiW / Ti / Cu
|
Electroplating Au
0.1 - 5.0 um in thickness
|
Electroless Ag
0.1 - 1.0 um in thickness
|
Polyimide
3 - 8 um in thickness
|
|
AlN
170 - 220 W/mK
Up to 4.5"
|
Cr / Cu
|
Printing
Ag
10 um in thickness
|
Electroplating
Ni / Au
3 - 9 um / 0.5 - 1.5 um in thickness
|
SU-8
2 - 10 um in thickness
|
|
Printing Cu
10 um in thickness
|
Electroplating Ni / Ag
3 - 9 um / 3.0 um in thickness
|
|
