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ERSA HR 100 - Patented Hybrid Rework
Technology The patented HR 100 ERSA Hybrid Rework system introduces
the revolutionary Hybrid heating technology which combines infrared as well
as convection heating in one hand tool for the soldering and de-soldering of
densely packed SMT components. By means of IR radiation augmented by a gentle
flow of hot air, the Hybrid Tool delivers homogenous heat to components
sizing from 0201s to 20 x 20 mm SMDs. Exchangeable hybrid adaptors focus 200
W of hybrid heating power onto the component while protecting chips from
blowing away. HR 100 Module Features:
Patented
Hybrid Rework Technology The
patented ERSA Hybrid Rework System HR 100 combines infrared and convection
heating in a hand-held device for safely soldering and de-soldering densely
packed SMDs. IR radiation heat transfer is combined and enhanced via a
precise amount of hot air. This unique hybrid tool can uniformly, safely and
rapidly heat components ranging from 0201s up to SMD sizes of 20 x 20 mm and
more. Three exchangeable hybrid adapters (available standard) focus up to 200
W of heating power from the hybrid heating element in a targeted manner
whilst neighboring components remain protected from overheating and blowing
away. Homogenous
heat radiation in the medium wavelength IR range, paired with gentle but
concentrated convection, provides a unique mix for efficient rework
soldering. For the small surfaces of modern CSP, QFN or MLF components, this
combination of heating technologies provides ideal conditions for efficient
heat transfer. The convective portion is so reduced as to avoid an over
heating and "blowing away" of adjacent chips. When compared to
ERSA's larger IR systems, the surface area size of the radiation is quite
small. Due to the shortened working distance to the component and the
convective portion, however, the efficiency of the hybrid heat transfer is
now comparable or even superior to the semi-automated IR machines. Efficient
and safe rework with the temperature gradients recommended by the IPC - up to
4°C/s is now possible with this bench top unit.
Important
differentiating factors for determining the right system are: 1.Type
of application - small
or high mass; metal or plastic; fine pitch CSP or BGA; densely populated PCB;
cost of PCB; soldering station required; in-housing repair. the component
type, thermal mass and board size determines which system is best. 2. SMD/BGA placement required
- the PL 550 or PL 650 must be used. Component type and size determines which
placement system is best. 3. Operator skills -
the lower end, bench top systems require more manual skills whereas the
larger systems require minimal computer skills. 4.
Rework cycle time - depending
on job type, the greater system power generally gets the job done faster. 5. High
mix and/or high volume -
flexibility to handle all board sizes & jobs increases as you move up the
rework line. The APR function of the IR 550 & IR 650 assists in high
volume repair (see new Rework Catalogue 2008). The larger the system, the
better the PCB mix from a board size and thermal mass standpoint. 6.
Rework success rate required -
if customer requires a >98% success rate, than the more automated IR 650
is the best choice. IR 550 can handle this as well but requires better
operator skills. 7.
Documentation required -
whereas all ERSA systems allow for the use of IRSoft, the documenation
capability increases as you move up the line. 8.
Evaluation required - ERSA can assist in
the evaluation process by determining the optimal rework process. This can be
done by sending a board to the ERSA Applications Centers in USA, Europe or
Asia. 9. Time
frame for investment - ERSA
rework systems generally have the shortest delivery times. Often the purchase
decision goes to that company that can deliver rapidly when required. Ordering information: 0IRHR100A-HP HR 100 & IRHP 100 as complete set 0IRHR100A Hybrid Rework System HR 100 with 200 W
Hybrid Tool, three Hybrid Adaptors, Adaptor changer, VacPen and tool holder |
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